Small Outline J Lead Package - a type of SO package with a lead that is bent under the package in what is referred to as a J lead configuration.

Small Outline J-leaded (package)

A plastic IC package with “J” leads on two sides. It resembles a plastic DIP or a SOIC except for lead spacing and forming.

Small-Outline J-lead, a type of chip module that uses J-shaped pins that extend inwards. Unlike DIPs, which plug into holes on the circuit board, an SOJ chip attaches directly to the circuit board's surface.

(Small Outline J-lead) A common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.

(Small-Outline J-lead) - A common form of surface-mounted DRAM packaging. An SOJ is a rectangular package with J-shaped leads on the two long sides.

Small outline J-lead package. A rectangular package with leads sticking out of the side of the package. The leads are formed in a J-bend profile, bending underneath and towards the bottom of the package.