An electronic package with a rectangular housing and a row of pins along each of two opposite sides.

A common physical package for ICs. Often in a rectangular package with 8 to 16 legs extending from the package.

Integrated circuit package having two rows of connecting pins.

A plastic or ceramic package with two rows of vertical leads.

A packaging technique for integrated circuits that incorporates two parallel rows of connecting pints.

In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins, usually protruding from the longer sides of the package and bent downward. A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14.