Board assemblies using leaded and leadless electronic components.
A technique for populating hybrids, multichip modules, and circuit boards, in which packaged components are mounted directly onto the surface of the substrate. A layer of solder paste is screen printed onto the pads and the components are attached by pushing their leads into the paste. When all of the components have been attached, the solder paste is melted using either reflow soldering or vapor-phase soldering.
A state-of-the-art construction method for electronic printed circuit boards (PCBs). The electronic components are attached to the top and or bottom surfaces of the PCB. The leads of the components are soldered to pads and do not pass through the PCB as with the older 'through-hole' method. Used to increase the packing density of electronic components and therefore increase the reliability and performance while reducing the overall system size.
Defines the entire body of processes and components that create printed circuit board assemblies with leadless components.
The technology used when components are mounted to the surface of circuit boards. Surface mount technology allows smaller component size, improves signal speed, increases reliability and automation in manufacturing, and requires less handling of parts.
The process of assembling printed circuit boards with components soldered to the surface rather than fastened to printed circuit board through-holes.
A technique of assembling SMDs or SMCs on the surface of PCBs and PWAs, as opposed to wiring them through holes. Surface mount technology offers a number of important advantages, but also some disadvantages, such as difficulty in defluxing under certain types of SMD.
An assembly process in which electonic components such as semiconductors, resistors and capacitors are attached to the surface of a substrate instead of having leads or pins that extend through holes in the substrate.
A method of assembling hybrid circuits and printed wiring boards where component parts are mounted onto, rather than into, the printed-wiring boards, as in the mounting components on substrates in hybrid technology.
is the principal technology for the assembly of printed circuit boards by soldering electrical components directly to a board substrate that uses less space than the pin-through-hole method. SMT is a highly flexible technology that can be continually reconfigured to meet customer-specific product requirements. Each SMT assembly line is designed to have PCB screen printing, component placement and solder reflow capabilities.
A manufacturing process that attaches components on the surface of the printed circuit board, rather than inserting components into plated through hole.
Components are mounted directly on to printed circuit boards rather than by wires passing through holes. Most modern printed circuit boards will use SMD technology. | | | | | | | | | J | K | L | | | | | | | | W | X | Y | Z
