Surface mount technology. The technology of creating printed wiring wherein components are soldered to the board without using holes. The result is higher component density, allowing for smaller PWB’s.
The pitch of the surface mount is defined as the dimension in inches from center to center of surface mount pads. Standard pitch is 0.025", fine pitch is 0.011"-0.025", and ultra fine pitch is 0.011". As boards contain finer pitch, processing and test fixture costs increase. Please note: the ultra fine pitch is not suited for the PCBexpress.
In the context of electrical engineering, surface mount refers to the assembly of electrical components by soldering them directly to the surface of a printed circuit board. This method was used in the later Spectra Speech Processors, the SPrint and ESPrit Speech Processors.
The method of mounting a hinge to the outside surface of a window frame.
Refers to a package with pads that mount to the surface of the PCB.
As contrasted to something mounted in a recessed fashion into the case surface.
A circuit board packaging technique in which the leads (pins) on the chips and components are soldered on top of the board.
The art of mounting electronic components on the surface of a printed circuit board rather than using the "through board" method. This allows more technology in a much smaller space and with much higher tolerances.
Mounted on the surface of a PCB
A component, either active or passive, having no separate leads but which is part of the component body to permit direct mounting on a printed circuit board.
Almost every electronic security product manufactured uses surface mount technology. This means that most of the electronic components are placed by machine, improving product reliability and production throughput. The surface mount machines used in the production process can place approximately 11,000-15,000 components an hour.
