A via on a multi-layer PCB which does not go completely through the board. Also known as buried via.

A plated interconnection from one layer to an adjacent layer through a fixed depth LASER drilled opening.

A via that is drilled from the surface of a printed wiring board and terminates within the substrate. Blind vias, when plated with copper, provide interconnection for some, but not all, of the layers of a multilayer printed wiring board. Blind vias are usually iployed to conserve space on high-density layers that do not require connection to the via.