(n) A form control for geometric dimensioning and tolerancing. Flatness indicates that all points on the surface must lie in a plane. Flatness for a planar surface is comparable to straightness for a line.
For extrusions, flatness pertains to the deviation of a cross-section surface intended to be flat. Flatness can be affected by conditions such as die performance, thermal effects and stretching.
That property of a web which describes its ability to maintain a planar shape under no stress.
The permissible variation of the flatness of a surface or characteristic. (empty)
Refers to the flatness of the wafer surface.
The deviation from the ideal straight line travel in a vertical plane. Also referred to as the vertical run-out.
Flatness is a measure of a cut length sheet's ability to conform to a flat horizontal surface. Maximum deviation from that surface is the degree to which the sheet is out of flat. Flatness is often expressed quantitatively in either Steepness or I-Units.
The maximum deviation of the wafer surface from a flat plane. Flatness measurement is usually done with the backside held to a flat surface (a vacuum chuck) and excludes linear thickness variations.
The condition of a surface having all of its elements in one plane. Flatness Control - A geometric tolerance that limits the amount of flatness error a surface is allowed. Floating Fastener Assembly - Where two (or more) components are held together with fasteners (such as bolts and nuts), and both components have clearance holes for the fasteners. Floating Fastener Formula - T = H - F Where: T = position tolerance diameter (for each part) H = MMC of the clearance hole
Measured by Helium light bands (0.0000116" or 0,3 microns) as opposed to surface finish that is measured by R.M.S. or C.L.A.
used in GD&T, the flatness of a plane is the degree to which it approximates a mathematical perfect plane
The allowable deviation of a surface from a reference plane. The tolerance zone is defined by two parallel planes within which the surface must lie.
for wafer surfaces, the deviation of the front surface, expressed as TIR or maximum FPD, relative to a specified reference plane when the back surface of the wafer is ideally flat, as when pulled down by vacuum onto an ideally clean flat chuck. The flatness of a wafer may be described as; 1. the global flatness, or 2. the maximum value of site flatness as measured on all sites, or 3. the percentage of sites which have a site flatness equal to or less than a specified value.
The degree to which a surface of a flat product approaches a plane.