The real part of the complex impedance of a semiconductor device. The resistance of the semiconductor package, die attach and bond wire are typically included in series resistance.
Parasitic resistance to current flow in a cell due to mechanisms such as resistance from the bulk of the semiconductor material, metallic contacts, and interconnections.
The resistance between the substrate contact to an MIS device and the MIS capacitor. This resistance is increased when substrate doping is low or backside contact is poor.
Ohmic resistance which is connected in series with the solar cell . It occurs at contact layers, in the conductive window layer in thin-film cells (TCO) as well as grids, and should be as small as possible in order to avoid resistance losses.