In general, wetting is the ability of a liquid to flow across a surface as opposed to sticking to itself. Wetting occurs when the attraction between liquid and surface is greater than the surface energy of the liquid, drawing a molecularly thin layer across itself. Wetting in soldering applies to molten solder spreading along the base metal/metallisation surfaces to produce a relatively uniform, smooth, unbroken and adherent film of solder. A good intermetallic bond between surfaces is formed. One action of flux is to reduce the surface tension of the solder to enhance wetting.Good wetting is indicated by a low ‘contact angle’ (positive wetting angle) between the solder fillet and the base metal/metallisation.
Spreading of a coating of molten solder on a metallic substrate usually leading to a layer of intermetallic compound between the substrate and solder.
(extended definition) Impregnation of a material by a liquid by replacement of an air/solid interface by a liquid medium/solid interface.
The formation of a relatively uniform, smooth, unbroken, and adherent film of solder to a base metal. Also, the free flow of solder alloy, with proper application of heat and flux, on a metallic surface to produce an adherent bond.
(extended definition) Thorough impregnation of a material by a liquid. (To know more about the importance of wetting, visit the Adhesion Guide )
The spreading of solder along the leads and pad to produce complete and uniform solder coverage.
wet. Covering with a surface with thin film of liquid. Liquid beads up on a surface if it cannot wet it.
The ability of liquid solder to attach itself to the surfaces being joined through the formation of intermatallic bonds.
The thorough impregnation of a material by a liquid. The more viscous a fluid, and the higher its surface tension, the more difficult it is for the liquid to "wet" materials. Certain additives, for example, water softeners, reduce surface tension, or viscosity and improve wetting properties, allowing the material to flow out more.
The action by which a cleaner penetrates and loosens the substrate-soil bond by lowering surface and interfacial tension.
The spreading and adherence of a liquid filler metal or flux in a thin continuous layer on a surface.
The relative ability of a liquid adhesive to display interfacial affinity for an adherend and to flow uniformly over the adherend surface. The more viscous a fluid, and the higher its surface tension, the more difficult it is for the liquid to "wet" materials. Wetting agents are added to help reduce surface tension, or viscosity and improve wetting properties.
is the phenomenon of the adherent contact of liquids to the surface of solids (or other liquids)
The coating of a substrate surface with an adhesive.
the degree to wich a liquid maintains contact with a surface. Poor wetting is indicated by liquids beeding up on a surface and good wetting is indicated by a continuous sheet of liquid forming on the surface.
A condition in which the interfacial tension between a liquid and a solid is such that the contact angle is 0 to 90 degrees.
The ability of an adhesive to flow uniformly over the laminated surface to which it is bonded.
the adhesion of a liquid to the surface of a solid.
Term used in soldering to describe the condition that occurs when the metals being soldered are hot enough to melt the solder so it flowes over the surface.
Wetting is the contact between a fluid and a surface, when the two are brought into contact. When a liquid has a high surface tension (strong internal bonds), it will form a droplet, whereas a liquid with low surface tension will spread out over a greater area (bonding to the surface). On the other hand, if a surface has a high surface energy (or surface tension), a drop will spread, or wet, the surface.
