A vertical opening that is filled with a conducting material, such as metal to allow for the electrical connection of several layers on the IC, typically either tungston or Cu
A small hole formed through the wafer or Printed Circuit Board and metallized, causing electrical connection to be made from the front (the side on which the circuitry is formed) to the backside of the wafer, substrate, or Printed Circuit Board.
A plated-through hole used to connect two or more conductor layers of a multilayer board, in which there is no intention to insert a component lead or other reinforcing material. See through-hole via, blind via, tented via and buried via.
A hole filled or lined with a conducting material which is used to link two or more conducting layers in a substrate.
A plated-thru hole in a printed wiring board. A via may may exist between one or more adjacent board layers, or through the entire board. A blind via runs vertically between the top [or bottom] side and through one or more adjacent board layers, but not through the entire board. A blind via runs between one or more adjacent internal layers, but does not run to the top or bottom layer. [ PWB Design
An opening in the dielectric layer(s) through which a riser passes, or else whose walls are made conductive.
a contact between two conductive layers.
Plated through-hole connecting two or more conductor layers of a printed circuit board.
A plated through hole that is used as an inter-layer connection, but doesn't have component lead or other reinforcing material inserted in it.
an opening in the dielectric layer(s) through which a riser passes, or in which the walls are made conductive; an area that provides an electrical pathway from one metal layer to the metal layer above or below.
A small hole drilled then plated or etched into a printed circuit board for continuing connectivity to a different layer of the printed circuit board.
Holes through dielectric layers, opened by etching. Metal will be deposited in the via to form a plug and create an interconnect between two metal lines.
A plated hole used to provide low inductance connections on an IC. A via may be formed through the dielectric layer on the top of a slice to interconnect two metallization patterns or may be formed through the back of a slice containing FETs where a low inductance earth is required.
A plated-through hole used for interconnection of conductors on different sides or layers of a PCB.
A plated-through hole used as a through connection between layers on the printed circuit board. Vias are not intended to be used for component lead insertion.
Feed-through. A plated-through hole in a PWB used to route a trace virtically in the board, that is, from one layer to another.
In printed circuit board design, via refers to a pad with a plated hole that connects copper tracks from one layer of the board to other layer(s). Either the holes are electroplated or small rivets are inserted. High-density multi-layer PCBs may have blind vias, which are visible only on one surface, or buried vias, which are visible on neither (http://www.nanofilm.com.sg/eng/images/app.pcb.hole.1.gif example image of each).