A condition in IR reflow soldering in which component bodies block the energy from certain areas of the board, resulting in incomplete melting of the solder paste at those points.
A condition occurring during etchback in which the dielectric material, in contact with the foil, is incompletely removed although acceptable etchback may have been achieved elsewhere.
A condition in which solder fails to wet the device leads during the wave-soldering process. Generally the trailing terminations of a component are affected, because the component body blocks the proper flow of solder. Requires proper component orientation to correct the problem.