The process of connecting two solder-coated conductive surfaces by remelting of the solder to cause fusion.
A process of joining metallic surfaces (without melting the base metals) through the mass heating of pre-placed solder (usually in the form of paste) to create solder fillets in the metallised areas.
A method of soldering involving application of solder prior to the actual joining. To solder, the parts are joined and heated, causing the solder to remelt, or reflow.
A method of electronics soldering commonly used with surface mount technology, whereby a paste formed of solder powder and flux suspended in an organic vehicle is melted by the application of external heat.
A surface mount technology process in which the substrate and attached components are passed through a reflow oven to melt the solder paste.
The process of screenprinting solder paste and then heating it to cause is to melt, or reflow , to wet the leads and pads around it.
a process of using heated air or infra red lamps to melt solder paste on the assembled PCB for SMT devices at once.
A process that enables the soldering of components through a gradual and controlled heating of the components and solders in a furnace, typically a belt furnace.
Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
The making of a solder joint by the melting of solder coatings already on the constituent members of the joint.
Reflow soldering is the most common means to attach a surface mounted component to a circuit board, and typically consists of applying solder paste, positioning the devices, and reflowing the solder in a conveyorized oven. The goal of the reflow process is to melt the powder particles in the solder paste, with the surfaces being joined together, and solidify the solder to create a strong metallurgical bond. There are usually four process zones in conventional reflow process, consisting of preheat, thermal soak (often shortened to just soak), reflow and cooling.
