Plating that proceeds without an external electricity source. A reduction of metal ions is accomplished with a chiical reducing agent (such as formaldehyde in electroless copper).
A process for chemically depositing metallic material on a nonconductive surface. It is primarily used for metallising holes in a circuit board to prepare them for addition of electroplated metal.
Term in use, but not recommended, for autocatelytic plating.
The controlled autocatalytic reduction of a metal ion on certain catalytic surfaces.
A process in which metal ions in a dilute aqueous solution are plated out on a substrate by means of autocatalytic chemical reduction.
Plating from an aqueous solution on any surface, caused by an autocatalytic chemical reduction.
A chemical process by which nonconductive materials may be plated with a thin highly conductive film without using electric current. A thicker deposit of the desired metal may then be applied using standard electroplating methods.
