A method of affixing unencapsulated integrated circuits onto a printed wiring board using a wire bonding process.

One of the many configurations in which a chip is directly bonded to a circuit board or substrate. These approaches include wirebonding, TAB, or solder interconnections, similar to the C4 structure. In low-end consumer systems, chip-on-board generally refers to wirebonding of chips directly to board bonded and subsequently protected with a glob of resin material. See also Direct Chip Attach.

is a method of affixing unencapsulated chips onto printed circuit boards using a wire bonding process.

A process in which unpackaged integrated circuits are physically and electrically attached to a circuit board, and are then encapsulated with a "glob" of protective material such as epoxy.

A configuration in which a chip is directly attached to a printed circuit board or substrate by solder or conductive adhesives.

A method of affixing an unencapsulated chip onto a printed circuit board using a wire bonding process.

The LCD driver wafer is mounted on the PCB with gold wires used to connect it to other circuits. It is covered with epoxy.