(PVD) (sc) the layering of a vapor, usually by means of evaporation or "sputtering."
A modern plating process used mostly with polished brass or gold finishes on faucets. Vaporized zirconium reacts with nitrogen and other gases to form a very durable surface, which will not tarnish or discolor.
Deposition method used commonly for metal layers through bombardment of target by gas plasma, often called "Sputtering"
(PVD) A process of thin film formation via transporting atoms evaporated from one surface onto another surface. Evaporation occurs due to surface heating or bombardment by high-energy ions in vacuum. The film composition replicates the target composition, unless it is additionally doped with other materials.
A dry vacuum process used to coat parts with ultra-hard zirconium and titanium nitrides.
Deposition of thin films by physical means as opposed to chemical (like chemical vapor deposition). This is most often used for deposition of metals. The most common form of PVD is sputtering, in which a metal target is exposed to a plasma made from a gas like argon which is not chemically reactive. The excited gas atoms hit the target and knock off metal atoms which deposit onto a wafer placed below, building up the desired metal film.
also known as sputtering, is used in a subtractive aluminum manufacturing process to deposit the thin conductive films that wire the transistors together. PVD is also used in a copper damascene manufacturing process to deposit the copper barrier layer (which helps to contain the copper lines in the device) and the copper seed layer (which serves as a nucleation layer on which the copper conductive fill "grows").
A process in which metallic metal vapor, such as titanium, is ionized in a plasma and combined with gas ions, such as nitrogen, to form a hard coating on the surface of a tool. The process temperature is usually several hundred degrees lower than is used for CVD, and coatings thickness is usually less than half that of a CVD coating.
A coating process whereby the cleaned and masked component to be coated is heated and rotated on a spindle above the streaming vapor generated by melting and evaporating a coating material source bar with a focused electron beam in an evacuated chamber.
a process where a film is deposited on a wafer by a physical process, for example, evaporation or sputtering.
Depositing a coating by condensing it from the vapor onto a substrate.
A method of depositing thin semiconductor photovoltaic) films. With this method, physical processes, such as thermal evaporation or bombardment of ions, are used to deposit elemental semiconductor material on a substrate.
Physical vapor deposition (PVD) is a technique used to deposit thin films of various materials onto various surfaces (e.g., of semiconductor wafers) by physical means, as compared to chemical vapor deposition.