Chemical vapor deposition (CVD) is a method for growing solids in which a gaseous precursor (containing fragments of the desired solid) is decomposed and deposited onto a desired surface. CVD is one of the most powerful synthetic methods in material science due to its remarkable flexibility. A variety of surfaces can be coated, and very thin layers can be applied if necessary.
(CVD) (sc) a method for depositing some of the layers which function as dielectrics, conductors or semiconductors. A chemical containing atoms of the material to be deposited reacts with another chemical, liberating the desired material, which deposits on the wafer while by-products of the reaction are removed from the reaction chamber.
A method of depositing thin semiconductor films used to make certain types of solar photovoltaic devices. With this method, a substrate is exposed to one or more vaporized compounds, one or more of which contain desirable constituents. A chemical reaction is initiated, at or near the substrate surface, to produce the desired material that will condense on the substrate.
Deposition of thin films (usually dielectrics/insulators) on silicon wafers by placing the wafers in a mixture of gases which react at the surface of the wafers. CVD can be done at medium to high temperature in a furnace, or in a CVD reactor in which the wafers are heated but the walls of the reactor are not. Plasma enhanced CVD avoids the need for a high temperature by exciting the reactant gases into a plasma.
processes are used to deposit dielectric films in an integrated circuit, as well as for depositing conductive metal layers, particularly those with line widths too small for effective deposition with PVD or other deposition technologies. CVD may be thought of as a high-tech spray painting process where paint vapor coats all the surfaces uniformly.
A process in which precursor chemicals, such as titanium tetrachloride and nitrogen gas, chemically react on the tool surface at temperatures of about 1000 degrees Centigrade to form a hard coating on the tool surface.
A process in which desired reinforcement material is deposited from vapor phase onto a continuous core; boron on tungsten, for example.
A process for growing thin films on a substrate, in which a gas containing the required molecules is converted into a plasma by heating it to extremely high temperatures using microwaves. The plasma carries atoms to the surface of the substrate where they are attracted to the crystalline structure of the substrate. This underlying structure acts as a template. The new atoms continue to develop the structure to build up a layer on the substrate's surface.
The use of gaseous precursor molecules to form solid films or powders. The process is widely used in the fabrication of semiconductors.
A coating process, similar to gas carburizing and carbonitriding, whereby a reactant atmosphere gas is fed into a processing chamber where it decomposes at the surface of the workpiece, liberating one material for either absorption by, or accumulation on the workpiece. A second material is liberated in gas form and is removed from the processing chamber, along with excess atmosphere gas.
A technique used to deposit thin layers of coatings on a substrate . In CVD, chemicals are vaporized and then applied to the substrate using an inert gas such as nitrogen as a carrier. CVD is used in the production of microchips, integrated circuits, sensors, and protective coatings.
is a process for depositing thin films from a chemical reaction of a vapor or gas.
a process whereby a film is deposited by reacting chemicals together in the gaseous or vapor phase to form a film. The gases or vapors utilized for CVD are compounds that contain the element to be deposited and that may be induced to react with a substrate or other gas(es) to deposit a film. The CVD reaction may be thermally activated, plasma induced, plasma enhanced CVD or activated by light in photon induced CVD. See also, Atmospheric Chemical Vapor Deposition, Low Pressure Chemical Vapor Deposition, Metal Organic Chemical Vapor Deposition, Photo Enhanced Chemical Vapor Deposition.
Depositing a coating by decomposition of a compound gas on a surface.
(CVD) One of the synthesis methods for carbon nanotubes. Large amounts of CNTs can be formed by catalytic CVD of acetylene over Co and Fe catalysts supported on silica or zeolite. The carbon deposition activity seems to relate to the cobalt content of the catalyst, whereas the CNTs' selectivity seems to be a function of the pH in catalyst preparation. Fullerenes and bundles of SWNTs were also found among the MWNTs produced on the carbon/zeolite catalyst. [Nanotechnology: Basic Science and Emerging Technologies”, M. Wilson et al, Chapman and Hall (2002)] CNTs have many unique and interesting properties, please visit our our applications page as well as our FAQs page to find out more about CNTs.
Chemical vapor deposition (CVD) is a chemical process used to produce high-purity, high-performance solid materials. The process is often used in the semiconductor industry to produce thin films. In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit.
