An operation in which a device is powered up for a period of time to stabilize and remove devices subject to infant mortality prior to moving them to the next manufacturing stage, or shipment to customers.
the process of exercising an integrated circuit at elevated voltage and temperature. This process accelerates failure normally seen as "infant mortality" in a chip. The resultant tested product is of high quality.
The process of operating devices or equipment often under accelerated voltage, temperature, or load in order to screen out infant mortality failures.
To run new devices and printed circuit cards, often at high temperatures, in order to pinpoint early failures.
A process where a device or assembly is subjected to electrical or physical stress to simulate actual or accelerated use. It is designed to verify the function of the device under test and also to weed out any possible devices with latent defects. Go back to the MENU Go to END
A test defined in MIL-STD-883 that involves applying high-voltage electrical tests at high temperatures for long periods to detect and discard parts that would fail before their specified lifespan.
The operation of equipment or components prior to their ultimate application; intended to stabilize their characteristics and to identify early failures.
Operating a battery charger or power supply, usually at or near rated load to verify the unit was manufactured correctly.
The operation of a newly fabricated device or system prior to application with the intent to stabilize the device, detect defects, and expose infant mortality.
A period, prior to on line operations, during which equipment is continuously energized for the purpose of forcing infant mortality failures.
The procedure of operating a SMPS for some period of time with the intent to eliminate the infant mortality and stabilizing the SMPS by aging. Temperature cycling and power cycling may also be applied during burn-in.
Statistically, if an electrical device is going to fail, it will most often occur during its first hours of operation. Some suppliers first operate new electrical products at their factory for a predetermined period to weed out problems before shipment to customers. This process is known as burn-in is conducted with the product under electrical or thermal load, to induce stress and make it easier to identify potential failures.
A long term screening test (either vibration, temperature or combined test) that is effective in weeding out premature failures because it simulates actual or worst case operation of the device, accelerated through a time, power, and temperature relationship.
The initial operation of the laser diode at the manufacturing facility to eliminate infant mortality failures, devices prone to catastrophic failure, and devices that have degradation rates exceeding customer specifications. The effectiveness of the burn-in depends on the operational conditions during burn-in, the burn-in time, and the acceptable changes in device performance during burn-in. BLI varies the burn-in to provide the desired reliability at the least expense to the customer. The effectiveness of the burn-in is verified with sample aging.
A process meant to improve reliability by stressing a semiconductor using elevated voltages and/or temperatures to force marginal devices to fail.
Device operation, usually under accelerated environmental conditions that simulate life in the devices' intended application, used to detect early-life (infantile) failures.
the use of elevated temperature and or electrical stress to cause infant mortality failures so they may be removed prior to shipping product to a customer. Burn-In is common on new products until yield enhancement efforts have increased yield and decreased defect density.
In power supplies, a period during which a supply is energized and loaded to peak output, with the intent of finding potentially weak components. Typical burn-in tests can include temperature cycling, input cycling, and/or load cycling.
The process of exercising an integrated circuit at elevated voltage and temperature. This process accelerates failures normally seen as "infant mortality" in a chip. (Those chips that would fail early during actual usage will fail during burn-in. Those that pass have a life expectancy much greater than that required for normal usage.)
The process in which a device is electrically stressed by subjecting it to an elevated temperature and voltage for an adequate period of time to cause the failure of a marginal device.
Subjecting a component or system to voltage and temperature stress for a period of time (such as 168 hours) followed by testing. The purpose is to screen out a weak component or equipment by stressing it prior to placing it in its intended application.