Type of transparent insulating material that covers the active circuit area except the bond pads and the scribe street. This is deposited on die destined for Flip-Chip use prior to tri-metal layer deposition.
(Benzocyclobutene) Dielectric coating that provides an additional passivation layer on top of the IC passivation for Repassivation, Redistribution, UltraCSP, and Polymer Collar WLP designs.
buffer control block. An opaque Cache Manager structure that is used to maintain state as a file system pins and releases data (for example, its volume structure) in the cache.